Numerical Simulation and Analysis for the Baking out System of the HT-7U Super-conducting Tokamak Device
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摘要: 在等离子体运行前,为了提高真空室的本体真空度,获得一个高真空等离子体运行环境,必须对真空室进行250℃壁处理烘烤,除去吸附在器壁表面上的杂质。基于此,本文提出了电阻丝和气流加热两种烘烤方案,并对其结构进行了数值模拟和分析,得出了真空室烘烤时的加热功率、温度分布和热应力情况,为HT-7U和同类超导托卡马克装置真空室烘烤结构的工程设计和优化提供了理论参数依据。Abstract: It can provide an ultrahigh vacuum location for the plasma operation. In order to improve its vacuum degree and attain a high quality operation environment for plasma, it is very important to proceed 250℃ baking out to clear the wall before the plasma operation. The paper firstly gives two kinds of structures for the baking of the vacuum vessel, in which one is the baking by electricity and another is baking by the nitrogen gas. Secondly based on the numerical simulation and analysis, some results have been attained such as the baking power, temperature field distribution and thermal stress for the vacuum vessel, which can provide some valuable theory basis for the engineering design and optimization of the baking system of the HT-7U vacuum vessel or other similar super-conducting tokamak devices.
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Key words:
- Tokamak /
- Vacuum vessel /
- Baking out /
- Numerical analysis
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