Numerical Simulation and Analysis for the Baking out System of the HT-7U Super-conducting Tokamak Device

It can provide an ultrahigh vacuum location for the plasma operation. In order to improve its vacuum degree and attain a high quality operation environment for plasma, it is very important to proceed 250℃ baking out to clear the wall before the plasma operation. The paper firstly gives two kinds of structures for the baking of the vacuum vessel, in which one is the baking by electricity and another is baking by the nitrogen gas. Secondly based on the numerical simulation and analysis, some results have been attained such as the baking power, temperature field distribution and thermal stress for the vacuum vessel, which can provide some valuable theory basis for the engineering design and optimization of the baking system of the HT-7U vacuum vessel or other similar super-conducting tokamak devices.