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Volume 27 Issue 3
Jun.  2006
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LI Zhi-hai, ZHOU Shang-qi, REN Qin, SHI Quan, QIU Shao-yu, LI Cong. Measurement of Plating Thickness by X-ray Diffraction Method[J]. Nuclear Power Engineering, 2006, 27(3): 43-46.
Citation: LI Zhi-hai, ZHOU Shang-qi, REN Qin, SHI Quan, QIU Shao-yu, LI Cong. Measurement of Plating Thickness by X-ray Diffraction Method[J]. Nuclear Power Engineering, 2006, 27(3): 43-46.

Measurement of Plating Thickness by X-ray Diffraction Method

  • Received Date: 2005-01-22
  • Rev Recd Date: 2005-03-28
  • Available Online: 2025-07-29
  • Thickness of electroless Ni-P alloy plating has been measured by the substrate X-ray diffraction method and measurement error was analyzed. It shows that the method is one non-destructive method to measure the plating thickness with high precision, and its measurement error is less than that of metallographic method within its measurement range. This method can used to measure the crystal and noncrystal plating because it is hardly effected by the crystal state of plating.

     

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